ML33111
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 16 = EP
(ML33111EP)
PLASTIC PACKAGE
CASE 648-08
NOTES:
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
F
C
L
0.740
0.770
0.270
0.175
0.021
0.070
18.80
6.35
3.69
0.39
1.02
2.54 BSC
1.27 BSC
0.21
19.55
6.85
4.44
0.53
1.77
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
0.110
0.295
S
SEATING
-T-
PLANE
M
K
0.015
0.130
0.305
0.38
3.30
7.74
H
J
2.80
7.50
G
D 16 PL
M
S
0°
10
0.040
°
0°
10
1.01
°
M
M
0.25 (0.010)
T
A
0.020
0.51
SO 16 = -5P
(ML33111-5P)
PLASTIC PACKAGE
CASE 751B-05
NOTES:
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
196
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
-B-
P 8 PL
M
M
0.25 (0.010)
B
1
8
MILLIMETERS
INCHES
G
DIM
A
B
C
D
F
G
J
K
M
P
9.80
3.80
1.35
0.35
0.40
10.00
4.00
1.75
0.49
1.25
0.386
0.393
0.157
0.068
0.019
0.049
0.150
0.054
0.014
0.016
F
K
R X 45°
1.27 BSC
0.050 BSC
C
0.19
0.10
0.25
0.25
0.008
0.004
0.009
0.009
-T-
J
0°
7°
0
°
7°
0.244
0.019
SEATING
PLANE
M
5.80
0.25
6.20
0.50
0.229
0.010
D 16 PL
R
M
S
S
0.25 (0.010)
T
B
A
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ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-
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