ML12079
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 8 = PP
PLASTIC PACKAGE
(ML12079PP)
CASE 626–05
ISSUE K
8
5
–B–
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
1
4
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F
–A–
NOTE 2
MILLIMETERS
INCHES
DIM
A
B
C
D
F
MIN
9.40
6.10
3.94
0.38
1.02
MAX
10.16
6.60
4.45
0.51
1.78
MIN
MAX
0.400
0.260
0.175
0.020
0.070
L
0.370
0.240
0.155
0.015
0.040
C
G
H
J
K
L
2.54 BSC
0.100 BSC
J
0.76
0.20
2.92
1.27
0.30
3.43
0.030
0.008
0.115
0.050
0.012
0.135
–T–
N
SEATING
PLANE
7.62 BSC
0.300 BSC
M
D
K
M
N
–––
10
–––
10
0.76
1.01
0.030
0.040
G
H
M
M
M
0.13 (0.005)
T
A
B
SO 8 = -5P
PLASTIC PACKAGE
(ML12079-5P)
CASE 751–06
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
A
C
8
1
5
M
M
0.25
B
H
E
4
MILLIMETERS
h X 45
DIM
A
A1
B
C
D
MIN
1.35
0.10
0.35
0.19
4.80
3.80
MAX
1.75
0.25
0.49
0.25
5.00
4.00
B
e
A
C
SEATING
PLANE
E
e
H
h
L
1.27 BSC
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
0.10
A1
B
M
S
S
0.25
C
B
A
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ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
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