Multilayer Ceramic Chip Capacitors
Surface Mounting Information
(Unit : mm)
Dimensions for recommended typical land
Standard
Size
L×W
a
b
c
Land Pattern
03
0.6×0.3
1.0×0.5
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
4.5×2.0
4.5×3.2
5.7×2.0
5.7×2.8
5.7×5.0
0.20 to 0.30 0.25 to 0.35 0.30 to 0.40
0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
0.70 to 1.00 0.80 to 1.00 0.60 to 0.80
1.00 to 1.30 1.00 to 1.20 0.80 to 1.10
2.10 to 2.50 1.10 to 1.30 1.00 to 1.30
2.10 to 2.50 1.10 to 1.30 1.90 to 2.30
2.50 to 3.20 1.80 to 2.30 1.50 to 1.80
2.50 to 3.20 1.80 to 2.30 2.60 to 3.00
4.20 to 4.70 2.00 to 2.50 1.50 to 1.80
4.20 to 4.70 2.00 to 2.50 2.20 to 2.60
4.20 to 4.70 2.00 to 2.50 4.20 to 4.70
Sample capacitor
05
105
21
c
316
32
b
a
Soldering resist
42
43
52
53
When mounting the capacitor to the substrate, it is important to
consider carefully that the amount of solder (size of fillet) used has a
direct effect upon the capacitor once it is mounted.
55
CA series : Please refer Page 19.
a) The greater the amount of solder, the greater the stress to the
elements. As this may cause the substrate to break or crack, it is
important to establish the appropriate dimensions with regard to the
amount of solder when designing the land of the substrate.
b) In the situation where two or more devices are mounted onto a
common land, separate the device into exclusive pads by using
soldering resist
(Unit : mm)
DN/DR Automotive Series
Size
105
21
L×W
a
b
c
1.6×0.8
2.0×1.25
3.2×1.6
0.60 to 0.90 0.80 to 1.00 0.70 to 1.00
0.90 to 1.20 0.80 to 1.20 0.90 to 1.40
1.40 to 1.90 1.00 to 1.30 1.30 to 1.80
316
Ideal Solder Thickness
T/3 to T/2
Chip Capacitor
T
Solder
PCB
Typical mounting problems
Item
Not recommended example
Recommended example/Separated by solder resist
Solder resist
Multiple parts mount
Solder resist
Mount with
leaded parts
Leaded parts
Leaded parts
Solder resist
Soldering iron
Wire
Wire soldering
after mounting
Solder resist
Solder resist
Overview
KYOCERA AVX [ KYOCERA AVX ]
