Recommended Reꢀlow Proꢀile
tP
TP
Ramp-up
TL
tL
TSMAX
tS Preheat
Ramp-down
TSMIN
25°C
Time
Time 25°C to Peak
Profile Feature
PbꢀFree
Average Ramp-up rate (TSMAX to TP)
3°C/second max.
Preheat
•
•
•
Temperature Min (TSMIN)
Temperature Max (TSMAX)
Time (TSMIN to TSMAX) (tS)
150°C
200°C
60–180 seconds
Time maintained above:
•
•
Temperature (TL)
Time (tL)
217°C
60–150 seconds
Peak Temperature (TP)
260°C
Time within 5°C of actual Peak Temperature (tP)
Ramp-down rate (TP to TSMAX)
20–40 seconds
6°C/second max
8 minutes max
Time 25°C to Peak Temperature
Notes:
Based on IPC/JDEC J-STD-020 Revision C.
All temperatures refer to topside of the package, measured on the package body surface
Additional Notes
(A)
(B)
(C)
MSL (moisture sensitivity level) Class 1.
Maximum of 3 reꢁlow cycles is recommended.
In order to minimize device damage:
• Do not board wash or clean after the reꢁlow process.
• Do not brush board with or without solvents after the reꢁlow process.
• Do not directly expose to ultrasonic processing, welding, or cleaning.
• Do not insert any object in port hole of device at any time.
• Do not apply over 30 psi of air pressure into the port hole.
• Do not pull a vacuum over port hole of the microphone.
• Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.
knowles.com
Datasheet SPH1642HT5H-1 Rev B
06
KNOWLES [ KNOWLES ELECTRONICS ]
