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IRF640NPBF 参数 Datasheet PDF下载

IRF640NPBF图片预览
型号: IRF640NPBF
PDF下载: 下载PDF文件 查看货源
内容描述: 先进的工艺技术动态的dv / dt额定值175工作温度 [Advanced Process Technology Dynamic dv/dt Rating 175 Operating Temperature]
分类和应用:
文件页数/大小: 11 页 / 8242 K
品牌: KERSEMI [ Kersemi Electronic Co., Ltd. ]
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Advanced Process Technology
l
Dynamic dv/dt Rating
l
175°C Operating Temperature
l
Fast Switching
l
Fully Avalanche Rated
l
Ease of Paralleling
l
Simple Drive Requirements
l
Lead-Free
Description
l
IRF640NPbF
IRF640NSPbF
IRF640NLPbF
HEXFET
®
Power MOSFET
D
V
DSS
= 200V
R
DS(on)
= 0.15Ω
G
S
Fifth Generation HEXFET
®
Power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance per
silicon area. This benefit, combined with the fast switching
speed and ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer with an
extremely efficient and reliable device for use in a wide
variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation levels
to approximately 50 watts. The low thermal resistance and
low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of its
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
The through-hole version (IRF640NL) is available for low-
profile application.
I
D
= 18A
TO-220AB
IRF640NPbF
D
2
Pak
IRF640NSPbF
TO-262
IRF640NLPbF
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current

Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
‚
Avalanche Current

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt
†
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
„
Max.
18
13
72
150
1.0
± 20
247
18
15
8.1
-55 to +175
300 (1.6mm from case )
10 lbf•in (1.1N•m)
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
www.kersemi.com
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