SOLID TANTALUM CHIP CAPACITORS
TANTALUM MnO
2
COMPONENT PERFORMANCE CHARACTERISTICS
(con’t.)
12. AC Operation
Permissible AC ripple voltage and current are
related to equivalent series resistance (ESR) and
power dissipation capability.
Permissible AC ripple voltage which may be
applied is limited by three criteria:
a. The positive peak AC voltage plus the DC
bias voltage, if any, must not exceed the DC
voltage rating of the capacitor.
b. The negative peak AC voltage, in combination
with the bias voltage, if any, must not exceed
the permissible reverse voltage ratings pre-
sented in Table 3.
c. The power dissipated in the ESR of the capa-
citor must not exceed the appropriate value
specified in Table 5.
Actual power dissipated may be calculated from
the following:
P =l R
Substituting I = E
,
P = E
2
R
Z
Z
2
where:
I = rms ripple current (amperes)
E = rms ripple voltage (volts)
P = power (watts)
Z = impedance at specified frequency (ohms)
R = equivalent series resistance at specified
frequency (ohms)
Using P max from Table 5, maximum allowable
rms ripple current or voltage may be determined
as follows:
P max/
P max/
I (max) =
R
E (max) = Z
R
These values should be derated at elevated tem-
peratures as follows:
Temperature
Derating Factor
85 C
.9
125 C
.4
2
FIGURE 9b ESR & Impedance (z) vs Frequency
ESR and Z are also affected by temperature. At
100 kHz, ESR decreases with increasing temper-
ature. The amount of change is influenced by the
size of the capacitor and is generally more pro-
nounced on smaller ratings.
10
Multiplier of 100KHz ESR
1
0.1
-50
-25
0
25
50
75
100
125
Temperature - Degrees Centigrade
FIGURE 10
Typical Effect of Temperature on 100 kHz ESR
11. AC Power Dissipation
Power dissipation is a function of capacitor size
and materials. Maximum power ratings have been
established for all case sizes to prevent overheat-
ing. In actual use, the capacitor’s ability to dissi-
pate the heat generated at any given power level
may be affected by a variety of circuit factors.
These include board density, pad size, heat sinks
and air circulation.
TABLE 5 Tantalum Chip Power Dissipation Ratings
Case Code
KEMET
EIA
R
2012-12
S
3216-12
T
3528-12
U
6032-15
V
7343-20
A
3216-18
B
3528-21
C
3062-28
D
7343-31
X
7343-43
E
7260-38
T530D
7343-31
T510X, T530X 7343-43
T510E, T530E 7260-38
Maximum Power Dissipation
mW @ +25°C w/+20°C Rise
25
60
70
90
125
75
85
110
150
165
200
255
270
285
ENVIRONMENTAL
13. Temperature Stability
TABLE 6 Temperature Stability Limits
Leakage
Dissipation
Temp.
Capacitance
Current
Factor
+25 C within specified within original within original
tolerance
limit
limit
2
-55 C within ± 10%
N/A
within original
of initial value
limit**
3
+25 C within ± 5%
within original within original
of initial value
limit
limit**
4
+ 85 C within ± 10%
within 10X
within original
of initial value
original limit
limit***
5
+125 C *within ± 12%or within 12X
within original
20% of initial
original limit
limit***
value
6
+25 C within ± 5%
within original within original
of initial value
limit
limit
*+12%
is standard. +15% or +20% applies to certain CV values
Contact KEMET representative for details.
**within 1.5x initial limit for extended CV values.
***within 1.15x initial limit for extended CV values.
Step
No.
1
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
9
Solid Tantalum Surface Mount
KEMET [ KEMET CORPORATION ]
