Tantalum chip capacitors
SpeedPower, Low ESR
Dimensional drawing
B45197A, B45198R, B450, B451
Encapsulation: molded epoxy resin
NiFe; tinned surface Sn100 or gold-plated
Reduced slot length for case size A
Dimensions
Case size
Dimensions in mm (inches)
KEMET
EIA/IECQ
L
W
A
3216-18
3.2
±0.2
(.126
±0.008)
3.5
±0.2
(.138
±0.008)
6.0
±0.3
(.236
±0.012)
7.3
±0.3
(.287
±0.012)
7.3
±0.3
(.287
±0.012)
1.6
±0.2
(.063
±0.008)
2.8
±0.2
(.110
±0.008)
3.2
±0.3
(.126
±0.012)
4.3
±0.3
(.169
±0.012)
4.3
±0.3
(.169
±0.012)
H
B
3528-21
C
6032-28
D
7343-31
E
7343-44
1.6
±0.2
(.063
±0.008)
1.9
±0.2
(.075
±0.008)
2.5
±0.3
(.098
±0.012)
2.8
±0.3
(.110
±0.012)
4.1
±0.3
(.161
±0.012)
L
2
typ. W
2
±0.1
H
2
typ. P
±0.3
±(.004)
±(.012)
3.2
1.2
1.3
0.8
(.126) (.047)
(.051) (.031)
3.5
2.2
(.138) (.087)
6.1
2.2
(.240) (.087)
7.3
2.4
(.287) (.094)
7.3
2.4
(.287) (.094)
1.4
0.7
(.055) (.027)
1.8
1.3
(.071) (.051)
1.8
1.3
(.071) (.051)
1.8
1.3
(.071) (.051)
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 3 of 26
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