Film Capacitors
AC Line EMI Suppression and RC Networks – R47 Series Metallized Polypropylene Film, Class X2, 520 VAC
Soldering Process
The implementation of the RoHS Directive has required the use
of SnAuCu (SAC) or SnCu alloys as primary solder. These alloys
require a higher liquidus temperature (217ºC – 221ºC) as compared
to SnPb eutectic alloy (183ºC). Due to the higher pre-heat and
wave temperatures, the heat stress to components has increased
considerably. Polypropylene capacitors are especially sensitive
to soldering temperature due to the relatively low melting point of
polypropylene material (160ºC – 170ºC). As a result, wave soldering
can be destructive, especially to mechanically small polypropylene
capacitors with lead spacings of 5 – 10 mm. For more information,
please refer to KEMET’s Recommended Soldering Profiles or contact
a KEMET representative. IEC Publication 61760–1 Edition 2 may
also be consulted for general guidelines.
Marking
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F3008_R47_X2_520 • 7/19/2012
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