Ceramic Capacitors
Military Grade Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) (cont.)
MIL-PRF-123 • High Reliability • BR (X7R) & BX (X7R) Dielectrics • 6.3VDC–200VDC
(Military Grade & Space Quality)
Size Code
EIA
Capacitance
Range
Voltage
Range (VDC)
Style
Dielectric
Benefits
0805
1206
1210
1808
1812
1825
2225
CKS51
CKS55
CKS52
CKS53
CKS56
CKS5ꢀ
CKS54
BP, BX
BP, BX
BP, BX
BP, BX
BP, BX
BP, BX
BP
1.0pF - 0.018µF
1.0pF - 0.039µF
300pF - 0.1µF
50 - 100
50 - 100
50 - 100
50 - 100
50 - 100
50 - 100
50
• -55°C to +125°C operating temperature range
• High reliability
• Non-polar device, minimizing installation concerns
• Tin coated (Sn60) end metallization option available
• SnPb plated (ꢀ0/30) end metallization option available
• Gold plated end metallization option available
300pF - 0.1µF
1200pF - 0.18µF
3900pF - 0.4ꢀµF
1100pF - 1.0µF
DSCC Approved • High Reliability • BP (C0G/NP0), BR (X7R) & BX (X7R) Dielectrics • 6.3VDC–200VDC
(Military Grade)
Size Code
EIA
Capacitance
Range
Voltage
Range (VDC)
Style
Dielectric
Benefits
0402
0603
0805
1206
2220
DSCC 03029
DSCC 03028
BR, BX
BR, BX
100pF - 2200pF
100pF - 0.1µF
6.3 - 200
6.3 - 200
10 - 200
10 - 200
25 - 50
• Defense Supply Center, Columbus approved
• Federal Stock Control Number, Cage Code 31433
• Meets US Department of Defense (USDoD) specifications
per MIL-PRF-55681
• Meets USDoD standards per MIL-STD-202 & MIL-STD-1285
• High reliability
DSCC 05006 BP, BR, BX 1.0pF - 0.018µF
DSCC 0500ꢀ BP, BR, BX 1.0pF - 0.04ꢀµF
• Non-polar device, minimizing installation concerns
DSCC 91019
BR
0.56µF - 1.0µF
Military Grade Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial-Off-The-Shelf (COTS) for Higher Reliability Applications • X7R and C0G Dielectrics • 6.3VDC–250VDC
(COTS • MIL Screened)
Size Code Dimensions
EIA/Metric L x W (mm)
Dielectric/
Capacitance Range
Voltage
Range (VDC)
Benefits
C0G – 0.5pF - 2200pF
XꢀR – 150pF - 0.1µF
10 - 100
6.3 - 50
0402/1005
0603/1608
1.0 x 0.5
1.6 x 0.8
C0G – 0.5pF - 0.015µF
XꢀR – 180pF - 0.4ꢀµF
10 - 200
6.3 - 200
• -55°C to +125°C operating temperature range
• Voltage conditioning and post-electrical testing per
• MIL-PRF-55681, Paragraph 4.8.3.1
• Destructive Physical Analysis (DPA) per EIA-469
• Humidity, steady state, low voltage (85/85) per MIL-STD
202, Method 103, Condition A
• Certificate of compliance
• RoHS-compliant (excluding SnPb end
metallization option)
• Non-polar device, minimizing installation concerns
• 100% pure matte tin plated end metallization allowing for
excellent solderability
• SnPb plated end metallization option available upon request
(5% min)
C0G – 0.5pF - 0.04ꢀµF
XꢀR – 180pF - 2.2µF
10 - 200
6.3 - 250
0805/2012 2.0 x 1.25
C0G – 10pF - 0.1µF
XꢀR – 1000pF - 10µF
10 - 200
6.3 - 250
1206/3216
1210/3225
1808/4520
1812/4532
1825/4564
2220/5650
2225/5664
3.2 x 1.6
3.2 x 2.5
4.5 x 3.2
4.5 x 3.2
4.5 x 6.4
5.6 x 5.0
5.6 x 6.3
C0G – 10pF - 0.022µF
XꢀR – 2200pF - 22µF
10 - 200
6.3 - 250
XꢀR – 4ꢀ00pF - 0.18µF
50 - 200
C0G – 4ꢀ0pF - 0.22µF
XꢀR – 6800pF - 10µF
50 - 200
25 - 250
C0G – 3900pF - 0.02ꢀµF
XꢀR – 0.022µF - 2.2µF
50 - 200
25 - 250
C0G – 6800pF - 0.4ꢀµF
XꢀR – 0.82µF - 22µF
50 - 200
25 - 250
C0G – 4ꢀ00pF - 0.033µF
XꢀR – 0.04ꢀµF - 2.2µF
50 - 200
50 - 250
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