SEMICONDUCTOR
TECHNICAL DATA
FEATURES
Plastic package has Underwriters Laboratory flammability
Classification 94V-0.
Glass passivated chip junction.
High surge overload rating : 35A peak.
Saves space on printed circuit boards.
High temperature soldering guaranteed : 260 /10 seconds.
2.67
2.41
4.95
4.55
0.74
0.43
MB6S
Single-Phase Bridge Rectifiers
[Unit:mm]
4.10
3.65
6.90
6.40
5.21
4.95
1.24
0.99
MAXIMUM RATING (Ta=25
CHARACTERISTIC
repetitive peak reverse voltage
RMS voltage
DC blocking voltage
Average forward output rectified
current (see Fig.1) On glass-epoxy
P.C.B on aluminum substrate.
Peak forward surge current
Rating for fusing (t<8.3ms)
Operating Junction and
Storage Temperature Range
)
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
I
2
t
Tj, Tstg
RATING
600
420
600
0.5 (Note1)
0.8 (Note2)
35.0
5.0
-55~150
UNIT
V
V
V
A
A
A
2
sec
0.19
0.16
0.8
0.41
0.15
0.96
0.48
1.47
1.37
0.20
0.10
2.90
2.80
1.57
1.47
0.46
0.36
2.70 2.90
2.30 2.40
MBS
Marking
Type Name
C
Lot No.
ELECTRICAL CHARACTERISTICS (Ta=25 )
CHARACTERISTIC
Forward voltage
Leakage current
Junction capacitance
Ta=25
Ta=125
SYMBOL
V
F
I
R
C
J
R
th
(A)
(Note1)
Typical thermal resistance
R
th
(A)
(Note2)
R
th
(L)
(Note1)
Junction to lead
-
-
Junction to ambient
-
-
70
20
/W
I
F
=0.4A
V
R
=600V
V
R
=4.0V, f=1.0MHz
CONDITION
MIN
-
-
-
-
TYP
-
-
-
13
MAX
1.0
5.0
100
-
85
UNIT
V
A
pF
Note 1) on glass epoxy P.C.B mounted on 0.05 0.05 (1.3 1.3mm) Pads.
Note 2) on aluminum substrate P.C.B with an area of 0.8 0.8 (20 20mm) mounted on 0.05 0.05 (1.3
1.3mm) solder pad.
2005. 6. 1
Revision No : 0
1/2
KEC [ KEC(KOREA ELECTRONICS) ]
