KING BILLION ELECTRONICS CO., LTD
駿 億 電 子 股 份 有 限 公 司
HE83R126
HE80000 SERIES
F. Pin Diagram
T
R
S
T
P
|
P
R
T
D
P
R
T
D
P
R
T
D
P
R
T
D
P
R
T
D
P
R
T
D
P
R
T
D
P
R
T
D
S
T
P
|
V
D
D
S
X
I
S
X
O
F
X
T
F
X
O
G
N
D
L
V
4
L
V
3
[0] [1] [2] [3] [4] [5] [6] [7]
P
N
LV2
VDD
PWMP
PWMN
GND
LV1
LVF
LC2
LC1
COM[0]
COM[1]
COM[2]
COM[3]
COM[4]
COM[5]
COM[6]
COM[7]
SEG[0]
SEG[1]
SEG[2]
SEG[3]
SEG[4]
SEG[5]
SEG[6]
SEG[7]
NC
NC
NC
NC]
Product name
NC
Die Size: 2350 µm * 3090 µm。
Substrate connect with GND。
NC
NC
NC
PRT15[7]/SEG[31]
PRT15[6]/SEG[30]
PRT15[5]/SEG[29]
PRT15[4]/SEG[28]
PRT15[3]/SEG[27]
P
R
T
P
R
T
P
R
T
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
E
G
S
S
E
G
E
G
15 15 15 [23] [22] [21] [20] [19] [18] [17] [16] [15] [14] [13] [12] [11] [10] [9] [8]
[2] [1] [0]
/
/
/
S
E
G
S
E
G
S
E
G
[26] [25] [24]
5
Preliminary V1.02E
KB [ King blillion Electronics Co.,Ltd. ]
