JIEJIE MICROELECTRONICS CO.,Ltd
Table 1
Sn63Sb37 Soldering conditions
Average heating rate
3℃/s (Max)
Low limit of temperature
TS(Min)
100℃
Preheating activation Upper limit of temperature TS(Max) 150℃
Time (min ~ max)
tS
60 ~ 90s
Melting point temperature
Peak temperature
TL
183℃ (Sn63Sb37)
240℃ (+0/-5℃)
TP
tp
Reflow zone
Reflow time
10～30s
(Peak temperature ±5℃)
Melting time
TL
40～60s
3.5℃/s
Maximum cooling rate
Recommended process time
300 ~ 360s
Sn63Pb37
T
p
250℃
200℃
t
P
T
L
(10-30S)
t
L
Ts(max)
(40-60S)
150℃
Ts(min)
100℃
ts
60-90S
Ordering Information
J M E 026 -16
12:VDRM/VRRM≥1200V
JieJie Microelectronics Co.,Ltd
16:VDRM/VRRM≥1600V
18:VDRM/VRRM≥1800V
20:VDRM/VRRM≥2000V
Module of series
E:Edge and corner gate
IT(AV)=26A
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