JIEJIE MICROELECTRONICS CO.,Ltd
Table 1
Sn63Sb37 Soldering conditions
Average heating rate
3℃/s (Max)
Low limit of temperature
TS(Min)
100℃
Preheating activation Upper limit of temperature TS(Max) 150℃
Time (min ~ max)
tS
60 ~ 90s
Melting point temperature
Peak temperature
TL
183℃ (Sn63Sb37)
240℃ (+0/-5℃)
TP
tp
Reflow zone
Reflow time
10～30s
(Peak temperature ±5℃)
Melting time
TL
40～60s
3.5℃/s
Maximum cooling rate
Recommended process time
300 ~ 360s
Sn63Pb37
T
p
250℃
t
P
T
L
(10-30S)
200℃
150℃
100℃
t
L
Ts(max)
(40-60S)
Ts(min)
ts
60-90S
Ordering Information
J M C 250 -16
JieJie Microelectronics Co.,Ltd
16:VDRM/VRRM≥1600V
18:VDRM/VRRM≥1800V
20:VDRM/VRRM≥2000V
Module of series
C:Central gate
IT(AV)=250A
TEL：+86-513-83639777
- 3 / 3-
http://www.jjwdz.com
JIEJIE [ JIEJIE MICROELECTRONICS CO.,Ltd ]
