Universal Contact
Universal Contact is an independent SMT contact which
provides an electrical connection between a device and a
PCB. The contact is manufactured as a single piece
stamped product, incorporating pre-load and anti-lift features.
The Universal Contact has been designed to replace
traditional interfaces where the contact is custom designed
into the component. It can be used to connect a number of
device components in any direction and configuration using
the same interface.
Additional Advantages of using Universal Contacts
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Qualification time reduction - same contact for many
components
Allows standard interface across applications and platforms
Freedom to position at an angle - not fixed by mating
component
Applications
Handset
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Solderless component interconnect
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I/O connector / Board to board
interconnect
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Battery contact / Antenna contact
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Grounding contact / SIM contact
Laptops & Computers
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Memory Stick
Home Electronic Devices / White Goods
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Smoke detectors / Security alarm
systems
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Home appliances
Automotive - Keyfob
Medical - CT scan equipment
Industrial - Circuit breaker for GPS beckon
Features & Benefits of the Design
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Range of heights available:
- 1.3mm contact with the minimum pitch of 1.35mm
- 1.8mm contact with the minimum pitch of 1.25mm
- 2.5mm contact the minimum pitch is 1.35mm
- 3.5 & 4.0mm minimum pitch is 1.45mm
Solderwell that prevents solder wicking up the
contact
“Side wings” protect the active parts of the
contact which prevent contact from
overstressing and potential damage
Domed contact point allows good hertz stress and
low contact resistance
The X-Y-Z movement allows robust connection
between the contact and component assembly
during shock and vibration
Compliant with WEEE and RoHS directives.
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Materials & Finishes
Base material
Plating
Beryllium Copper
Selective Au in contact area 1 µm
min over Au stripe, 0.05 - 0.1 µm over
Ni 1.0 - 3.0 µm
Electrical
Contact resistance
Max current rating
Environmental
Operating temperature
Humidity
Solder systems
Vibration
Shock
Mechanical
-40˚C and +85˚C
Operable in 90% relative humidity
(temp + 40˚C)
Infrared and hot air reflow
In accordance with IEC 68-2-36
In accordance with IEC 68-2-27, 30 g
See selection table on the right for
contact forces at specific mating heights
Maximum mating cycle based on mating PCB plated with 0.05µ Au
over 2.0µ m Ni = 3,000 cycles. (Wear resistance is subject to mating
component surface finish and plating type, increased mating
component plating spec = increased mating cycles.)
Packaging
Packaged in 12mm wide tape & reel
packaging to EIA-481 standards
© 2006 ITT Industries, Inc.
Specifications and other data are based on information available at the time of printing,
and are subject to change without notice.
Max 20 mΩ
2.0 amps nominal 3.0 amps peak
ITT [ ITT INDUSTRIES ]
