ZIF Connectors
DL/DLM/DLD
PCB Pad Layout
For the PC/RC Versions; The contact tail design
has been modified from a 0,64 (.025) square pin to
a 0,05 (.020) diameter round pin. The change
enables a decrease in the diameter of the through-
holes as well as the solder mounds on PCB’s (d1,
and d2 can be wider than D1 and D2). This can
reduce the crosstalk in RF circuits and enhance the
dielectric withstanding voltage in high voltage
circuits.
Dimensions
1,14 (.045)
0,47 (.018)
1,44 (.057)
0,62 (.024)
D1
D2
d1
d2
PCB Pad Layout
The soldering of contacts into through (THRU) However, a smaller diameter contact results in
holes on a PC Board has become standard for higher impedance.
medical equipment and test equipment for semi-
CONNECTOR
INSULATOR
CONTACT
Cannon designed a solution with a smaller
conductors. As a result of the narrow spacing
diameter contact tail. This design application
between the solder pad and circuit pattern,
allows the use of a smaller through-hole diameter.
crosstalk between signals increases. A solution to
this problem is to make the diameter of the
contacts and solder lands smaller to provide more
space between the lands and the patterns.
PCB
THRU HOLE
SOLDER
PC TAIL
Dimensions are shown in mm (inch)
Dimensions subject to change
64
ITT [ ITT Cannon ]
