IS61WV51216ALL
IS61WV51216BLL
IS64WV51216BLL
512K x 16 HIGH-SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH 3.3V SUPPLY
OCTOBER2009
FEATURES
• High-speed access times:
8, 10, 20 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for greater
noise immunity
DESCRIPTION
The ISSI IS61WV51216ALL/BLL and IS64WV51216BLL
are high-speed, 8M-bit static RAMs organized as 512K
words by 16 bits. It is fabricated using ISSI's high-perform-
anceCMOStechnology.Thishighlyreliableprocesscoupled
withinnovativecircuitdesigntechniques,yieldshigh-perfor-
mance and low power consumption devices.
• Easy memory expansion with CE and OE op-
tions
• CE power-down
• Fully static operation: no clock or refresh
required
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of the
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
• TTL compatible inputs and outputs
• Single power supply
VDD 1.65V to 2.2V (IS61WV51216ALL)
speed = 20ns for VDD 1.65V to 2.2V
VDD 2.4V to 3.6V (IS61/64WV51216BLL)
speed = 10ns for VDD 2.4V to 3.6V
speed = 8ns for VDD 3.3V + 5%
• Packages available:
The device is packaged in the JEDEC standard 44-pin
TSOP Type II and 48-pin Mini BGA (9mm x 11mm).
–
48-ball miniBGA (9mm x 11mm)
– 44-pin TSOP (Type II)
• Industrial and Automotive Temperature Support
• Lead-free available
• Data control for upper and lower bytes
FUNCTIONAL BLOCK DIAGRAM
512K x 16
MEMORY ARRAY
A0-A18
DECODER
VDD
GND
I/O0-I/O7
Lower Byte
I/O
DATA
COLUMN I/O
CIRCUIT
I/O8-I/O15
Upper Byte
CE
OE
WE
CONTROL
CIRCUIT
UB
LB
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. F
10/01/09
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
