HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
15.60
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.020
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.5985
0.2914
0.0125
-
-A-
o
0.6141 15.20
3
h x 45
D
0.2992
7.40
4
-C-
0.05 BSC
1.27 BSC
-
α
µ
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C A M B S
N
α
24
24
7
o
o
o
o
0
8
0
8
-
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
17
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
