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AS7C33256NTF32A-10TQC 参数 Datasheet PDF下载

AS7C33256NTF32A-10TQC图片预览
型号: AS7C33256NTF32A-10TQC
PDF下载: 下载PDF文件 查看货源
内容描述: [ZBT SRAM, 256KX32, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100]
分类和应用: 静态存储器内存集成电路
文件页数/大小: 18 页 / 427 K
品牌: ISSI [ INTEGRATED SILICON SOLUTION, INC ]
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AS7C33256NTF32A  
AS7C33256NTF36A  
®
Functional description  
The AS7C33256NTF32A/36A family is a high performance CMOS 8 Mbit Synchronous Static Random Access Memory (Flowthrough  
SRAM) organized as 262,144 words × 32 or 36 bits and incorporates a LATE Write.  
This variation of the 8Mb sychronous SRAM uses the No Turnaround Delay (NTD) architecture, featuring an enhanced write operation  
that improves bandwidth over pipelined burst devices. In a normal flowthrough burst device, the write data, command, and address are all  
applied to the device on the same clock edge. If a read command follows this write command, the system must wait for one 'dead' cycle for  
valid data to become available. This dead cycle can significantly reduce overall bandwidth for applications requiring random access or read-  
modify-write operations.  
NTDdevices use the memory bus more efficiently by introducing a write latency which matches one-cycle flow-through read latency.  
Write data is applied one cycle after the write command and address, allowing the read pipeline to clear. With NTD, write and read  
operations can be used in any order without producing dead bus cycle.  
Assert R/W low to perform write cycles. Byte write enable controls write access to specific bytes, or can be tied low for full 32/36 bit writes.  
Write enable signals, along with the write address, are registered on a rising edge of the clock. Write data is applied to the device one clock  
cycle later. Unlike some asynchronous SRAMs, output enable OE does not need to be toggled for write operations; it can be tied low for  
normal operations. Outputs go to a high impedance state when the device is de-selected by any of the three chip enable inputs.  
Use the ADV (burst advance) input to perform burst read, write and deselect operations. When ADV is high, external addresses, chip select,  
R/W pins are ignored, and internal address counters increment in the count sequence specified by the LBO control. Any device operations,  
including burst, can be stalled using the CEN=1, the clock enable input.  
The AS7C33256NTF32A and AS7C33256NTF36A operate with a 3.3V ± 5% power supply for the device core (VDD). DQ circuits use a  
separate power supply (VDDQ) that operates across 3.3V or 2.5V ranges. These devices are available in a 100-pin 14×20 mm TQFP package  
Capacitance  
Parameter  
Input capacitance  
I/O capacitance  
Symbol  
Test conditions  
V = 0V  
Min  
Max  
Unit  
pF  
*
C
-
-
5
7
IN  
in  
*
C
V = V = 0V  
pF  
I/O  
in  
out  
*
Guaranteed not tested  
TQFP thermal resistance  
Description  
Conditions  
Symbol  
Typical  
40  
Units  
°C/W  
°C/W  
1–layer  
4–layer  
θJA  
θJA  
Thermal resistance  
(junction to ambient)1  
Test conditions follow standard test methods  
and procedures for measuring thermal  
impedance, per EIA/JESD51  
22  
Thermal resistance  
(junction to top of case)1  
θJC  
8
°C/W  
1 This parameter is sampled  
11/8/04, v. 1.1  
Alliance Semiconductor  
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