December 2004
®
AS7C331MFT32A
AS7C331MFT36A
3.3V 1M
×
32/36 Flow-through synchronous SRAM
Features
•
•
•
•
•
•
•
Organization: 1,048,576 words × 32 or 36 bits
Fast clock to data access: 7.5/8.5/10 ns
Fast OE access time: 3.5/4.0 ns
Fully synchronous flow-through operation
Asynchronous output enable control
Available in 100-pin TQFP package
Individual byte write and global write
•
•
•
•
•
•
Multiple chip enables for easy expansion
3.3V core power supply
2.5V or 3.3V I/O operation with separate V
DDQ
Linear or interleaved burst control
Snooze mode for reduced power-standby
Common data inputs and data outputs
Logic block diagram
LBO
CLK
ADV
ADSC
ADSP
A[19:0]
20
CLK
CE
CLR
Q0
Burst logic
Q1
2
2
D
Q
CE
Address
register
CLK
D
DQ
d
Q
Byte write
registers
CLK
D
DQ
Q
c
Byte write
registers
CLK
D
DQ
b
Q
Byte write
registers
CLK
DQ
a
Q
Byte write
registers
CLK
D
Enable
CE
register
CLK
Q
D
1M × 32/36
Memory
array
20
18
20
32/36
32/36
GWE
BWE
BW
d
BW
c
BW
b
BW
a
CE0
CE1
CE2
4
OE
Output
registers
CLK
Input
registers
CLK
ZZ
Power
down
D
Enable
Q
delay
register
CLK
32/36
DQ[a:d]
OE
Selection guide
Minimum cycle time
Maximum clock access time
Maximum operating current
Maximum standby current
Maximum CMOS standby current (DC)
-75
8.5
7.5
325
140
90
-85
10
8.5
300
130
90
-10
12
10
275
130
90
Units
ns
ns
mA
mA
mA
12/23/04, v 1.3
Alliance Semiconductor
1 of 19
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