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AS7C251MNTD32A-133TQIN 参数 Datasheet PDF下载

AS7C251MNTD32A-133TQIN图片预览
型号: AS7C251MNTD32A-133TQIN
PDF下载: 下载PDF文件 查看货源
内容描述: [ZBT SRAM, 1MX32, 3.8ns, CMOS, PQFP100, 14 X 20 MM, LEAD-FREE, TQFP-100]
分类和应用: 静态存储器内存集成电路
文件页数/大小: 18 页 / 436 K
品牌: ISSI [ INTEGRATED SILICON SOLUTION, INC ]
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AS7C251MNTD32A  
AS7C251MNTD36A  
®
AC test conditions  
• Output load: For tLZC, tLZOE, tHZOE, and tHZC, see Figure C. For all others, see Figure B.  
• Input pulse level: GND to 2.5V. See Figure A.  
Thevenin equivalent:  
• Input rise and fall time (measured at 0.25V and 2.25V): 2 ns. See Figure A.  
• Input and output timing reference levels: 1.25V.  
+2.5V  
319/1667Ω  
50  
DOUT  
353 /1538  
7
+
2.5V  
VL=VDDQ/2  
DOUT  
5 pF*  
GND  
90%  
10%  
GND  
Figure A: Input waveform  
90%  
30 pF*  
10%  
*including scope  
and jig capacitance  
Figure B: Output load (A)  
Figure C: Output load(B)  
Notes  
1) For test conditions, see “AC test conditions”, Figures A, B, and C  
2) This parameter measured with output load condition in Figure C.  
3) This parameter is sampled, but not 100% tested.  
4) tHZOE is less than tLZOE, and tHZC is less than tLZC at any given temperature and voltage.  
5) tCH is measured high above VIH, and tCL is measured low below VIL  
6) This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK. All other synchronous inputs must  
meet the setup and hold times with stable logic levels for all rising edges of CLK when chip is enabled.  
7) Write refers to R/  
W
and BW[a,b,c,d]  
.
8) Chip select refers to CE0  
,
CE1, and CE2.  
1/17/05, V 1.2  
Alliance Semiconductor  
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