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42S32200 参数 Datasheet PDF下载

42S32200图片预览
型号: 42S32200
PDF下载: 下载PDF文件 查看货源
内容描述: 512K位×32位×4 ,银行(64 - MBIT )同步动态RAM [512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM]
分类和应用:
文件页数/大小: 55 页 / 977 K
品牌: ISSI [ INTEGRATED SILICON SOLUTION, INC ]
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IS42S32200
PIN FUNCTIONS
Symbol
A0-A10
Pin No.
25 to 27
60 to 66
24
Type
Input Pin
Function (In Detail)
Address Inputs: A0-A10 are sampled during the ACTIVE
ISSI
command (row-address A0-A10) and READ/WRITE command (A0-A7
with A10 defining auto precharge) to select one location out of the memory array
in the respective bank. A10 is sampled during a PRECHARGE command to
determine if all banks are to be precharged (A10 HIGH) or bank selected by
BA0, BA1 (LOW). The address inputs also provide the op-code during a LOAD
MODE REGISTER command.
Input Pin
Input Pin
Input Pin
Bank Select Address: BA0 and BA1 defines which bank the ACTIVE, READ,
WRITE or PRECHARGE command is being applied.
CAS,
in conjunction with the
RAS
and
WE,
forms the device command. See the
"Command Truth Table" for details on device commands.
®
BA0, BA1
CAS
CKE
22,23
18
67
The CKE input determines whether the CLK input is enabled. The next rising edge
of the CLK signal will be valid when is CKE HIGH and invalid when LOW. When
CKE is LOW, the device will be in either power-down mode, clock suspend mode,
or self refresh mode. CKE is an asynchronous input.
CLK is the master clock input for this device. Except for CKE, all inputs to this
device are acquired in synchronization with the rising edge of this pin.
The
CS
input determines whether command input is enabled within the device.
Command input is enabled when
CS
is LOW, and disabled with
CS
is HIGH. The
device remains in the previous state when
CS
is HIGH.
I/O0 to I/O15 are I/O pins. I/O through these pins can be controlled in byte units
using the DQM0-DQM3 pins
CLK
CS
68
20
Input Pin
Input Pin
I/O0 to
I/O31
2, 4, 5, 7, 8, 10,11,13
74,76,77,79,80,82,83,85
45,47,48,50,51,53,54,56
31,33,34,36,37,39,40,42
16,28,59,71
I/O Pin
DQM0
DQM3
Input Pin
DQMx control thel ower and upper bytes of the I/O buffers. In read mode,
the output buffers are place in a High-Z state. During a WRITE cycle the input data
is masked. When DQMx is sampled HIGH and is an input mask signal for write
accesses and an output enable signal for read accesses. I/O0 through I/O7 are
controlled by DQM0. I/O8 throughI/O15 are controlled by DQM1. I/O16 through I/
O23 are controlled by DQM2. I/O24 through I/O31 are controlled by DQM3.
RAS,
in conjunction with
CAS
and
WE,
forms the device command. See the
"Command Truth Table" item for details on device commands.
WE,
in conjunction with
RAS
and
CAS,
forms the device command. See the
"Command Truth Table" item for details on device commands.
V
CCQ
is the output buffer power supply.
V
CC
is the device internal power supply.
GND
Q
is the output buffer ground.
GND is the device internal ground.
RAS
WE
V
CCQ
V
CC
GND
Q
GND
19
17
3,9,35,41,49,55,25,81
1,15,29,43
6,12,32,38,46,52,78,84
44,58,72,86
Input Pin
Input Pin
Supply Pin
Supply Pin
Supply Pin
Supply Pin
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION
08/14/03
Rev. 00B
3