ISOCOM
COMPONENTS
H11L1, H11L1V
IR REFLOW SOLDERING TEMPERATURE PROFILE
(One Time Reflow Soldering is Recommended)
260°C
TP
TP - 5°C
tP
Max Ramp Down Rate
6°C/s
Max Ramp Up Rate
3°C/s
217°C
TL
TL
200°C
Tsmax
150°C
Tsmin
ts Preheat
60s – 120s
25°C
TIME (s)
Time 25°C to Peak Temperature
Profile Details
Preheat
Conditions
- Min Temperature (TSMIN
)
150°C
- Max Temperature (TSMAX
)
200°C
- Time TSMIN to TSMAX (ts)
60s - 120s
Soldering Zone
- Peak Temperature (TP)
260°C
- Time at Peak Temperature
- Liquidous Temperature (TL)
10s max
217°C
- Time within 5°C of Actual Peak Temperature (TP
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
̶
5°C)
30s max
60s - 100s
3°C/s max
6°C/s max
- Ramp Down Rate (TP to TL)
Average Ramp Up Rate (Tsmax to TP)
Time 25°C to Peak Temperature
3°C/s max
8 minutes max
DD93224
10 11/08/2017
ISOCOM [ ISOCOM COMPONENTS ]
