IRLML6402
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
V
(BR)DSS
∆V
(BR)DSS
/∆T
J
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Min.
-20
–––
–––
–––
-0.40
6.0
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ. Max. Units
Conditions
––– –––
V
V
GS
= 0V, I
D
= -250µA
-0.009 ––– V/°C Reference to 25°C, I
D
= -1mA
0.050 0.065
V
GS
= -4.5V, I
D
= -3.7A
Ω
0.080 0.135
V
GS
= -2.5V, I
D
= -3.1A
-0.55 -0.95
V
V
DS
= V
GS
, I
D
= -250µA
––– –––
S
V
DS
= -10V, I
D
= -3.7A
––– -1.0
V
DS
= -20V, V
GS
= 0V
µA
––– -25
V
DS
= -20V, V
GS
= 0V, T
J
= 70°C
––– -100
V
GS
= -12V
nA
––– 100
V
GS
= 12V
8.0
12
I
D
= -3.7A
1.2 1.8
nC V
DS
= -10V
2.8 4.2
V
GS
= -5.0V
350 –––
V
DD
= -10V
48 –––
I
D
= -3.7A
ns
588 –––
R
G
= 89Ω
381 –––
R
D
= 2.7Ω
633 –––
V
GS
= 0V
145 –––
pF
V
DS
= -10V
110 –––
ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Min. Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
29
11
-1.3
A
-22
-1.2
43
17
V
ns
nC
Conditions
MOSFET symbol
showing the
G
integral reverse
p-n junction diode.
T
J
= 25°C, I
S
= -1.0A, V
GS
= 0V
T
J
= 25°C, I
F
= -1.0A
di/dt = -100A/µs
D
S
Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
Surface mounted on 1" square single layer 1oz. copper FR4 board,
steady state.
Pulse width
≤
400µs; duty cycle
≤
2%.
Starting T
J
= 25°C, L = 1.65mH
R
G
= 25Ω, I
AS
= -3.7A.
**
For recommended footprint and soldering techniques refer to application note #AN-994.
2
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