IRLML6401PbF
Micro3 (SOT-23) Package Outline
Dimensions are shown in millimeters (inches)
6
D
A
A2
C
DIMENSIONS
A
5
SYMBOL
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
3
6
E1
1
2
E
0.15 [0.006] M C B A
0.10 [0.004] C
A1
3X b
0.20 [0.008] M C B A
5
B
e
e1
NOTES:
H 4
L1
Recommended Footprint
c
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
L2
0.972
0.950
0.89
0.01
0.88
0.30
0.08
2.80
2.10
1.20
0.95
1.90
0.40
0.54
0.25
0
1.12
0.10
1.02
0.50
0.20
3.04
2.64
1.40
BSC
BSC
0.60
REF
BSC
8
##
0.0004
#
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REF
BSC
0
8
"$
L2
3X L
7
0.802
2.742
1. DIMENSIONING & TOLERANCING PER ANSI Y14.5M-1994
2. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
3. CONTROLLING DIMENSION: MILLIMETER.
4. DATUM PLANE H IS LOCATED AT THE MOLD PARTING LINE.
5. DATUM A AND B TO BE DETERMINED AT DATUM PLANE H.
6. DIMENSIONS D AND E1 ARE MEASURED AT DATUM PLANE H. DIMENSIONS DOES
NOT INCLUDE MOLD PROTRUSIONS OR INTERLEAD FLASH. MOLD PROTRUSIONS
OR INTERLEAD FLASH SHALL NOT EXCEED 0.25 MM [0.010 INCH] PER SIDE.
7. DIMENSION L IS THE LEAD LENGTH FOR SOLDERING TO A SUBSTRATE.
8. OUTLINE CONFORMS TO JEDEC OUTLINE TO-236 AB.
1.900
Micro3 (SOT-23/TO-236AB) Part Marking Information
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Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/
www.irf.com
7
IRF [ INTERNATIONAL RECTIFIER ]
