( )&(PbF)
S
IR2104
IN C H E S
MILLIMETERS
DIM
MIN
D
B
MAX
.0688
.0098
.020
MIN
1.35
0.10
0.33
0.19
4.80
3.80
MAX
1.75
0.25
0.51
0.25
5.00
4.00
FOOTPRINT
8X 0.72 [.028]
5
A
.0532
A
E
A1 .0040
b
c
.013
.0075
.189
.0098
.1968
.1574
8
1
7
2
6
3
5
6
D
E
e
H
.1497
0.25 [.010]
A
.050 BASIC
1.27 BASIC
6.46 [.255]
4
e 1 .025 BASIC
0.635 BASIC
H
K
L
y
.2284
.0099
.016
0°
.2440
.0196
.050
8°
5.80
0.25
0.40
0°
6.20
0.50
1.27
8°
3X 1.27 [.050]
e
6X
8X 1.78 [.070]
K x 45°
e1
A
C
y
0.10 [.004]
8X c
8X L
A1
B
8X b
0.25 [.010]
7
C
A
NOTES:
5
6
7
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. CONTROLLING DIMENSION: MILLIMETER
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.
DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO
A SUBSTRATE.
01-6027
01-0021 11 (MS-012AA)
8 Lead SOIC
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13
INFINEON [ Infineon ]
