( )
S
IR2103
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol
Definition
High side floating absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Min.
Max.
Units
V
-0.3
625
B
S
V
V
- 25
V
B
V
B
+ 0.3
+ 0.3
25
B
V
HO
V
- 0.3
S
V
V
CC
-0.3
-0.3
-0.3
—
V
V
+ 0.3
+ 0.3
LO
CC
V
Logic input voltage (HIN &
)
V
CC
LIN
IN
dV /dt
s
Allowable offset supply voltage transient
50
V/ns
P
Package power dissipation @ T ≤ +25°C (8 Lead PDIP)
—
1.0
0.625
125
200
150
150
300
D
A
W
(8 Lead SOIC)
—
Rth
Thermal resistance, junction to ambient
(8 Lead PDIP)
(8 Lead SOIC)
—
JA
°C/W
°C
—
T
T
Junction temperature
—
J
Storage temperature
-55
—
S
T
Lead temperature (soldering, 10 seconds)
L
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V offset rating is tested with all supplies biased at 15V differential.
S
Symbol
Definition
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Min.
Max.
Units
V
V
S
+ 10
V + 20
S
B
S
V
Note 1
600
V
HO
V
V
B
S
V
V
CC
10
0
20
V
V
CC
LO
V
Logic input voltage (HIN &
)
0
V
CC
LIN
IN
°C
T
A
Ambient temperature
-40
125
Note 1: Logic operational for V of -5 to +600V. Logic state held for V of -5V to -V . (Please refer to the Design Tip
S
S
BS
DT97-3 for more details).
2
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