IR2103/IR21034
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol
V
B
V
S
V
HO
V
CC
V
LO
V
IN
dVs/dt
P
D
Definition
High side floating absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Logic input voltage (HIN &
LIN
)
Allowable offset supply voltage transient
Package power dissipation @ T
A
≤
+25°C
(8 Lead PDIP)
(8 Lead SOIC)
(14 lead PDIP)
(14 lead SOIC)
Min.
-0.3
V
B
- 25
V
S
- 0.3
-0.3
-0.3
-0.3
—
—
—
—
—
—
—
—
—
—
-55
—
Max.
625
V
B
+ 0.3
V
B
+ 0.3
25
V
CC
+ 0.3
V
CC
+ 0.3
50
1.0
0.625
1.6
1.0
125
200
75
120
150
150
300
Units
V
V/ns
W
Rth
JA
Thermal resistance, junction to ambient
(8 Lead PDIP)
(8 Lead SOIC)
(14 lead PDIP)
(14 lead SOIC)
°C/W
T
J
T
S
T
L
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
°C
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V
S
offset rating is tested with all supplies biased at 15V differential.
Symbol
V
B
V
S
V
HO
V
CC
V
LO
V
IN
T
A
Definition
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Logic input voltage (HIN &
LIN
)
Ambient temperature
Min.
V
S
+ 10
Note 1
V
S
10
0
0
-40
Max.
V
S
+ 20
600
V
B
20
V
CC
V
CC
125
Units
V
°C
Note 1: Logic operational for V
S
of -5 to +600V. Logic state held for V
S
of -5V to -V
BS
.
2
IRF [ INTERNATIONAL RECTIFIER ]
