10ETF..S QUIET
IR
Series
I2140 rev. A 12/99
Thermal-Mechanical Specifications
Parameters
T
J
T
stg
Max. Junction Temperature Range
Max. Storage Temperature Range
10ETF..S Units
- 40 to 150
- 40 to 150
1.5
40
240
2 (0.07)
°C
°C
°C/W
°C/W
°C
g (oz.)
Conditions
R
thJC
Max. Thermal Resistance Junction
to Case
R
thJA
Max. Thermal Resistance Junction
to Ambient (PCB Mount)**
T
s
wt
Soldering Temperature
Approximate Weight
Case Style
DC operation
D
2
Pak (SMD-220)
**When mounted on 1" square (650mm
2
) PCB of FR-4 or G-10 material 4 oz (140µm) copper 40°C/W
For recommended footprint and soldering techniques refer to application note #AN-994
M a x im u m A llo w a ble C a se T e m p e ra t u re ( °C )
M a xim u m A llo w a b le C a se T e m p e ra tu re (° C )
150
1 0 E T F..S S e rie s
R
thJC
( D C ) = 1 .5 ° C /W
1 50
1 0 E T F..S S e r ie s
R
thJC
(D C ) = 1 .5 °C / W
145
140
1 45
1 40
Co ndu ctio n Ang le
Co ndu ction Perio d
135
30°
130
125
120
0
2
4
6
8
10
12
A v e ra g e Fo r w a rd C u rre n t ( A )
60°
90°
120°
180°
1 35
1 30
1 25
1 20
0
2
4
6
8
10
12
14
16
A v e ra g e Fo rw a rd C u rre n t ( A )
3 0°
6 0°
90°
120°
180°
DC
Fig. 1 - Current Rating Characteristics
M a xim u m A v e ra g e F o rw a rd P o w e r L o ss ( W )
M a xim u m A v e r a ge Fo rw a rd P o w e r Lo ss ( W )
16
14
12
10
8
6
C o nduc tio n Ang le
Fig. 2 - Current Rating Characteristics
20
DC
1 80 °
1 20 °
90 °
60 °
30 °
1 80 °
1 20 °
90°
60°
30°
R M S L im it
16
12
RM S L im it
8
Co ndu ctio n Pe rio d
4
2
0
0
2
4
6
8
10
A v e ra g e Fo rw a rd C u rre n t ( A )
1 0 E TF ..S S e rie s
T
J
= 1 5 0 °C
4
1 0 E T F..S Se rie s
T
J
= 1 5 0 °C
0
4
8
12
16
0
A v e ra g e Fo rw a rd C u rre n t ( A )
Fig. 3 - Forward Power Loss Characteristics
Fig. 4 - Forward Power Loss Characteristics
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