10ETF06SPbF
QUIET
IR
Series
Bulletin I2204 03/05
Thermal-Mechanical Specifications
Parameters
T
J
T
stg
Max. Junction Temperature Range
Max. Storage Temperature Range
10ETF..
- 40 to 150
- 40 to 150
1.5
40
240
2 (0.07)
Units
°C
°C
°C/W
°C/W
°C
g (oz.)
Conditions
R
thJC
Max. Thermal Resistance Junction
to Case
R
thJA
Max. Thermal Resistance Junction
to Ambient (PCB Mount)**
T
s
wt
Soldering Temperature
Approximate Weight
Case Style
Marking Device
DC operation
D
2
Pak (SMD-220)
10ETF06S
** When mounted on 1" square (650mm
2
) PCB of FR-4 or G-10 material 4 oz (140µm) copper 40°C/W
For recommended footprint and soldering techniques refer to application note #AN-994
Maximum Allowa ble Case T
emperature (°C)
10ET
F..SS
eries
R
thJC
(DC) = 1.5 °C/ W
Maximum Allowable Cas T
e emperature (°C)
150
145
140
150
145
140
10ET
F..SS
eries
R
thJC
(DC) = 1.5 °C/ W
Conduction Angle
Cond uction Period
135
130
125
120
30°
60°
90°
120°
180°
0
2
4
6
8
10
12
135
130
125
120
30°
60°
90°
120°
180°
12
DC
14
16
0
2
4
6
8
10
Average F
orward Current (A)
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Maximum Average Forward Power Loss (W)
Maximum Average Forward Power Loss (W)
16
14
12
10
8
6
Cond uction Angle
Fig. 2 - Current Rating Characteristics
20
DC
180°
120°
90°
60°
30°
180°
120°
90°
60°
30°
RMSLimit
16
12
8
R
MSLimit
Conduction Period
4
2
0
0
2
4
10ET ..SS
F
eries
T
J
= 150°C
6
8
10
4
10ET
F..SS
eries
T
J
= 150°C
0
4
8
12
16
0
Average Forward Current (A)
Average Forward Current (A)
Fig. 3 - Forward Power Loss Characteristics
Fig. 4 - Forward Power Loss Characteristics
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