Ceramic Ball Grid
Termination Arrays
Environmental Data
Environmental Test
Thermal shock
Low temperature operation
Short time overload
High temperature exposure
Effects of solder
Moisture resistance
Life
Specification
MIL-PRF-83401
MIL-PRF-83401
MIL-PRF-83401
MIL-PRF-83401
MIL-PRF-83401
MIL-STD-202, Method 206
65°C, 45% RH, with bias
MIL-PRF-83401
Typical
±0.01%
±0.01%
±0.01%
±0.03%
±0.01%
±0.02%
±0.01%
Maximum
±0.02%
±0.05%
±0.05%
±0.05%
±0.05%
±0.01%
±0.02%
Physical Data and Schematic Diagrams for 1.0mm Pitch Series
A
A
1.00mm
±0.25mm
9.00mm
±0.15mm
0.64mm ±0.05 diameter
solder bumps
B
C
B
C
1.00mm
±0.25mm
4.0mm
±0.15mm
D
D
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
CD0910A isolated schematic
(view from top)
CD0910B bussed schematic
(view from top)
2
3
0.50mm
±0.25mm
4
5
6
7
8
9
0.63mm
±0.1mm
1.27mm
±0.16mm
A
A
1.00mm
±0.25mm
9.00mm
±0.15mm
0.64mm ±0.05 diameter
solder bumps
B
B
1.00mm
±0.25mm
3.0mm
±0.15mm
C
C
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
0.50mm
±0.25mm
3
4
5
6
7
8
9
1.27mm
±0.16mm
CC0910A isolated schematic
(view from top)
CC0910B bussed schematic
(view from top)
0.63mm
±0.1mm
Note: Contact A1 indicator marked with dot on top of part. Coplanarity between solder bumps 0.06mm.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CHC Series Issue April 2009 Sheet 3 of 4
IRCTT [ IRC - A TT ELECTRONICS COMPANY. ]
