High Reliability
Surface Mount Resistor
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
±100 ppm/°C
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.25% + 0.01 ohm
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% 0.01 ohm
±0.5% 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
IRC Advanced Film Division
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
√
P x R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 sec-
onds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exert pull on chip contacts for 10 seconds
Ordering Data
Sample Part No.
DESC Drawing Number
Resistance Value
(CHP 1/8, CHP 1/2, CHP 1, or CHP 2)
(100 ohms and greater - First 3 significant digits plus 4th digit multiplier)
Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503
(Less than 100 ohms - "R" is used to designate decimal)
Example: 51 ohms = 51R0, 1.6 ohm = 1R60, 0.25 ohms = R250
95011
- 2213 - F - 13
Tolerance
(F = 1.0%; G = 2.0%; J = 5.0%)
Packaging Code*
(BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel)
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
MCHP Series Issue September 2008 Sheet 2 of 2
IRCTT [ IRC - A TT ELECTRONICS COMPANY. ]
