HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Ordering Information (Continued)
Ordering Information
TEMP.
TEMP.
PART
NUMBER
PART
MARKING
RANGE
PKG.
DWG. #
PART
NUMBER
PART
MARKING
RANGE
PKG.
DWG. #
o
o
( C)
PACKAGE
( C)
PACKAGE
HIN239CPZ
(See Note)
HIN239CPZ 0 to 70 24 Ld PDIP*
(Pb-free)
E24.3
HIN232CB
232CB
0 to 70 16 Ld SOIC
M16.3
HIN232CB-T 232CB
0 to 70 Tape and Reel
HIN240CN
HIN240CN
0 to 70 44 Ld MQFP Q44.10X10
HIN232CBZ
(See Note)
232CBZ
0 to 70 16 Ld SOIC
(Pb-free)
M16.3
HIN240CNZ
(See Note)
HIN240CNZ 0 to 70 44 Ld MQFP Q44.10X10
(Pb-free)
HIN232CBZ-T 232CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN240CNZ-T HIN240CNZ 0 to 70 44 Ld MQFP Tape and Reel
(See Note)
(Pb-free)
HIN232CP
HIN232CP
0 to 70 16 Ld PDIP
E16.3
E16.3
HIN241CA
HIN241CA
0 to 70 28 Ld SSOP
M28.209
M28.209
HIN232CPZ
(See Note)
HIN232CPZ 0 to 70 16 Ld PDIP*
(Pb-free)
HIN241CAZ
(See Note)
HIN241CAZ 0 to 70 28 Ld SSOP
(Pb-free)
HIN232IB
232IB
232IB
232IBZ
-40 to 85 16 Ld SOIC
M16.3
M16.3
HIN241CB
241CB
0 to 70 28 Ld SOIC
M28.3
M28.3
HIN232IB-T
-40 to 85 Tape and Reel
HIN241CB-T 241CB
0 to 70 Tape and Reel
HIN232IBZ
(See Note)
-40 to 85 16 Ld SOIC
(Pb-free)
HIN241CBZ
(See Note)
241CBZ
0 to 70 28 Ld SOIC
(Pb-free)
HIN232IBZ-T 232IBZ
(See Note)
-40 to 85 Tape and Reel (Pb-free)
HIN241CBZ-T 241CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN232IP
HIN232IP
-40 to 85 16 Ld PDIP
E16.3
E16.3
HIN241IB
241IB
-40 to 85 28 Ld SOIC
M28.3
M28.3
HIN232IPZ
(See Note)
HIN232IPZ -40 to 85 16 Ld PDIP*
(Pb-free)
HIN241IBZ
(See Note)
241IBZ
-40 to 85 28 Ld SOIC
(Pb-free)
HIN236CB
236CB
0 to 70 24 Ld SOIC
M24.3
M24.3
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
HIN236CBZ
(See Note)
236CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN237CB
237CB
0 to 70 24 Ld SOIC
M24.3
M24.3
HIN237CB-T 237CB
0 to 70 Tape and Reel
HIN237CBZ
(See Note)
237CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN237CBZ-T 237CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN238CB
238CB
0 to 70 24 Ld SOIC
M24.3
M24.3
HIN238CB-T 238CB
0 to 70 Tape and Reel
HIN238CBZ
(See Note)
238CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN238CBZ-T 238CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN238CP
HIN238CP
0 to 70 24 Ld PDIP
E24.3
E24.3
HIN238CPZ
(See Note)
HIN238CPZ 0 to 70 24 Ld PDIP*
(Pb-free)
HIN238IB
238IB
-40 to 85 24 Ld SOIC
M24.3
M24.3
HIN238IBZ
(See Note)
238IBZ
-40 to 85 24 Ld SOIC
(Pb-free)
HIN239CB
239CB
0 to 70 24 Ld SOIC
M24.3
M24.3
HIN239CB-T 239CB
0 to 70 Tape and Reel
HIN239CBZ
(See Note)
239CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN239CBZ-T 239CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN239CP
HIN239CP
0 to 70 24 Ld PDIP
E24.3
3
INTERSIL [ Intersil ]
