EL2250, EL2450
Typical Performance Curves
(Continued)
Input Resistance vs Die
Temperature
Supply Current vs Supply Voltage
(per amplifier)
Supply Current vs Die
Temperature (per amplifier)
Offset Voltage vs Die Temperature
(4 Samples)
Input Bias Current vs Input
Voltage
Input Offset Current and Input Bias
Current vs Die Temperature
Positive Output Voltage Swing vs
Die Temperature, R
L
= 150Ω to
GND
Negative Output Voltage Swing vs
Die Temperature, R
L
= 150Ω to
GND
Channel to Channel Isolation vs
Frequency
1.8
Package Power Dissipation vs Ambient Temp.
SEMI G42-88 Single Layer Test Board
1.2
1
Power Dissipation (W)
0.8
0.6
0.4
0.2
0
Package Power Dissipation vs Ambient Temp.
JEDEC JESD51-3 Low Effective Thermal Conductivity
Test Board
1.042W
SO
1.6 1.54W
Power Dissipation (W)
1.4 1.25W
1.2
1
0.8
0.6
0.4
0.2
0
0
25
50
75 85 100
125
Ambient Temperature (°C)
150
θ
J
θ
P
JA
DIP
=8 1
4
1°
C/
W
781W
SO
8
θ
14
θ
JA
=
A
=
PD
I
10 P8
0°
C/
W
JA
=
16
0
12
0°
C/
W
°C
/W
0
25
50
75 85 100
125
Ambient Temperature (°C)
150
9
FN7061.3
May 19, 2006
INTERSIL [ INTERSIL CORPORATION ]
