HCS154MS
Die Characteristics
DIE DIMENSIONS:
85 x 101 mils
2.16 x 2.57mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS154MS
Y1
(2)
Y0
(1)
VCC
(24)
A0
(23)
A1
(22)
Y2
(3)
Y3
(4)
(21) A2
Y4
(5)
(20) A3
(19)
E2
Y5
(6)
Y6
(7)
(18)
E1
Y7
(8)
(17)
Y15
Y8
(9)
(16)
Y14
Y9
(10)
(11)
Y10
(12)
GND
(13)
Y11
(14)
Y12
(15)
Y13
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8
FN2479.3
January 6, 2011
INTERSIL [ INTERSIL CORPORATION ]
