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5962F9563004VXC 参数 Datasheet PDF下载

5962F9563004VXC图片预览
型号: 5962F9563004VXC
PDF下载: 下载PDF文件 查看货源
内容描述: 抗辐射16通道CMOS模拟多路复用器具有高阻抗模拟输入保护 [Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection]
分类和应用: 复用器
文件页数/大小: 7 页 / 408 K
品牌: INTERSIL [ INTERSIL CORPORATION ]
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HS-1840ARH, HS-1840AEH, HS-1840BRH
Ceramic Metal Seal Flatpack Packages (Flatpack)
A
e
PIN NO. 1
ID AREA
A
K28.A
MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B)
28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
INCHES
SYMBOL
MIN
0.045
0.015
0.015
0.004
0.004
-
0.460
-
0.180
0.030
MAX
0.115
0.022
0.019
0.009
0.006
0.740
0.520
0.550
-
-
MILLIMETERS
MIN
1.14
0.38
0.38
0.10
0.10
-
11.68
-
4.57
0.76
1.27 BSC
0.20
6.35
0.66
0.00
-
28
0.38
9.40
1.14
-
0.04
MAX
2.92
0.56
0.48
0.23
0.15
18.80
13.21
13.97
-
-
NOTES
-
-
-
-
-
3
-
3
-
7
-
2
-
8
6
-
-
Rev. 0 5/18/94
-A-
-B-
D
A
b
S1
b
E1
0.004 M
Q
A
-C-
-H-
L
E3
SEATING AND
BASE PLANE
c1
LEAD FINISH
E2
E3
L
H A-B S
D S
E
0.036 M
H A-B S
C
-D-
D S
b1
c
c1
D
E
E1
E2
E3
e
k
L
0.050 BSC
0.008
0.250
0.026
0.00
-
28
0.015
0.370
0.045
-
0.0015
BASE
METAL
b1
M
M
(b)
SECTION A-A
(c)
Q
S1
M
N
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the lim-
its of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum lim-
its of lead dimensions b and c or M shall be measured at the cen-
troid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners.
7. For bottom-brazed lead packages, no organic or polymeric mate-
rials shall be molded to the bottom of the package to cover the
leads.
8. Dimension Q shall be measured at the point of exit (beyond the
meniscus) of the lead from the body. Dimension Q minimum
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-
der dip lead finish is applied.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
7
FN4355.4
November 17, 2011