EL5102, EL5103, EL5202, EL5203, EL5302
Typical Performance Curves (Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2
1
1.2
1
1.136W
1.087W
543mW
SO8
1.116W
θ
=110°C/W
JA
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
QSOP16
=112°C/W
θ
JA
0
25
50
75 85 100
125
150
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
FIGURE 38. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 37. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.7
1
607mW
0.6
791mW
MSOP8/10
0.8
488mW
QSOP16
0.5
0.4
0.3
0.2
0.1
0
θ
=206°C/W
JA
781mW
θ
=158°C/W
JA
0.6
0.4
0.2
0
SOT23-5/6
=256°C/W
SO8
=160°C/W
θ
θ
JA
JA
0
25
50
75 85 100
125
150
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
FIGURE 39. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN7331.6
June 23, 2006
12
INTERSIL [ Intersil ]
