HA-5002
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
N20.35 (JEDEC MS-018AA ISSUE A)
0.042 (1.07)
0.056 (1.42)
0.004 (0.10)
C
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
PIN (1) IDENTIFIER
0.025 (0.64)
0.045 (1.14)
0.050 (1.27) TP
INCHES
MILLIMETERS
R
C
L
SYMBOL
MIN
MAX
MIN
4.20
2.29
9.78
8.89
3.59
9.78
8.89
3.59
MAX
4.57
NOTES
A
A1
D
0.165
0.090
0.385
0.350
0.141
0.385
0.350
0.141
0.180
0.120
0.395
0.356
0.169
0.395
0.356
0.169
-
3.04
-
-
D2/E2
D2/E2
10.03
9.04
C
L
D1
D2
E
3
E1 E
4.29
4, 5
-
10.03
9.04
VIEW “A”
E1
E2
N
3
4.29
4, 5
6
0.020 (0.51)
MIN
20
20
A1
D1
D
Rev. 2 11/97
A
SEATING
PLANE
0.020 (0.51) MAX
3 PLCS
-C-
0.026 (0.66)
0.032 (0.81)
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
0.045 (1.14)
MIN
VIEW “A” TYP.
NOTES:
1. Controllingdimension:INCH. Convertedmillimeterdimensionsare
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
FN2921.11
13
March 8, 2006
INTERSIL [ Intersil ]
