HR150 参数 Datasheet PDF下载

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BOTTOM VIEW CASE F4

HR150

SERIES

20 WATT

Solder Seal

1.350 max (4.39)

1.173

(29.79)

Squared corner and dot on top

of case indicate pin one.

0.040 dia.

(1.02)

1

2

3

4

5

Solder Tip-off

0.173

(4.39)

0.000

10

9

8

7

6

Seal hole: 0.083 ±0.003 (2.11 ±0.08)

Case dimensions in inches (mm)

Tolerance ±0.005 (0.13) for three decimal places

±0.01 (0.3) for two decimal places

unless otherwise specified

CAUTION

Heat from reflow or wave soldering may damage the device.

Solder pins individually with heat application not exceeding 300°C for 10 seconds per pin.

Materials

Header

Cold Rolled Steel/Nickel/Tin

Cover

Cold Rolled Steel/Nickel/Tin

Pins

#52 alloy, compression glass seal or ceramic seal

Case F4, Rev C, 20060802

Please refer to the numerical dimensions for accuracy. All information is believed to be accurate,

but no responsibility is assumed for errors or omissions. Interpoint reserves the right to make

changes in products or specifications without notice.

Copyright © 1999-2006 Interpoint Corp. All rights reserved.

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f4 – HR153

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HR150 Rev E 20100212

1.950 max (49.53)

0.505 max

(12.83)

0.170 (4.32)

0.570 (14.48)

0.970 (24.64)

1.370 (34.80)

1.770 (44.96)

0.000

0.250/0.300

(6.35/7.62)

0.000