10ETS12SPbF
SAFE
IR
Series
Bulletin I2206 03/05
Voltage Ratings
V
RRM
, maximum
Part Number
peak reverse voltage
V
1200
V
RSM
, maximum non repetitive
peak reverse voltage
V
1300
I
RRM
150°C
mA
0.5
10ETS12SPbF
Absolute Maximum Ratings
Parameters
I
F(AV)
Max. Average Forward Current
I
FSM
I
2
t
Max. Peak One Cycle Non-Repetitive
Surge Current
Max. I
2
t for fusing
Values
10
170
200
130
145
Units
A
A
A
2
s
A
2
√s
Conditions
@ T
C
= 105° C, 180° conduction half sine wave
10ms Sine pulse, rated V
RRM
applied
10ms Sine pulse, no voltage reapplied
10ms Sine pulse, rated V
RRM
applied
10ms Sine pulse, no voltage reapplied
t = 0.1 to 10ms, no voltage reapplied
I
2
√t
Max. I
2
√t
for fusing
1450
Electrical Specifications
Parameters
V
FM
r
t
Max. Forward Voltage Drop
Forward slope resistance
Values
1.1
20
0.82
0.05
0.50
Units
V
mΩ
V
mA
Conditions
@ 10A, T
J
= 25°C
T
J
= 150°C
T
J
= 25 °C
T
J
= 150 °C
V
F(TO)
Threshold voltage
I
RM
Max. Reverse Leakage Current
V
R
= rated V
RRM
Thermal-Mechanical Specifications
Parameters
T
J
T
stg
Max. Junction Temperature Range
Max. Storage Temperature Range
Values
- 40 to 150
- 40 to 150
2.5
62
240
2 (0.07)
Units
°C
°C
°C/W
°C/W
°C
g (oz.)
Conditions
R
thJC
Max. Thermal Resistance Junction
to Case
R
thJA
Max. Thermal Resistance Junction
to Ambient (PCB Mount)*
T
s
wt
Soldering Temperature
Approximate Weight
Case Style
Device Marking
DC operation
D
2
Pak (SMD-220)
10ETS12S
* When mounted on 1" square (650mm
2
) PCB of FR-4 or G-10 material 4 oz (140µm) copper 40°C/W
For recommended footprint and soldering techniques refer to application note #AN-994
2
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