253669 参数 Datasheet PDF下载

型号：	253669
PDF下载：	下载PDF文件查看货源
内容描述：	双核英特尔®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用：
文件页数/大小：	104 页 / 3687 K
品牌：	INTEL [ INTEL CORPORATION ]

Introduction................................................................................................................. 9

1.1

术语..................................................................................................... 11

1.2

数据的状态............................................... .................................................. ... 12

1.3

参考文献....................................................................................................... 12

电气规格................................................ ............................................... 15

2.1

前端总线和GTLREF ............................................. ................................... 15

2.2

电源和接地土地.............................................. ...................................... 15

2.3

解耦准则................................................ ........................................ 16

2.3.1 VCC去耦............................................. ......................................... 16

2.3.2 VTT解耦............................................. ......................................... 16

2.3.3前端总线AGTL +解耦.......................................... .................. 16

2.4

前端总线时钟（ BCLK [ 1 ： 0 ] ）和处理器时钟................................... .... 16

2.4.1前端总线频率选择信号（ BSEL [ 2 ： 0 ] ） ................................. 17

2.4.2锁相环（ PLL）和过滤器....................................... ....................... 18

2.5

电压识别（ VID ） ............................................. ................................... 19

2.6

保留或未使用的信号.............................................. .................................. 21

2.7

前端总线信号组............................................. ................................. 21

2.8

GTL +异步和AGTL +异步信号........................................... 23

2.9

测试访问端口（ TAP ）连接........................................... ............................ 23

2.10混合Processors.............................................................................................. 24

2.11绝对最大和最小额定值............................................ ................. 24

2.12处理器的DC规格.............................................. .................................. 25

2.12.1 VCC过冲规范............................................ ........................ 31

2.12.2模电压验证............................................ ................................. 32

机械Specifications............................................................................................. 33

3.1

包装机械制图............................................... .............................. 33

3.2

处理器组件禁入区.............................................. ..................... 37

3.3

包装装入规格............................................... ............................ 37

3.4

包处理指南............................................... ................................ 38

3.5

包插入规格............................................... ........................... 38

3.6

处理器群众规格............................................... .............................. 38

3.7

处理器Materials............................................................................................ 38

3.8

处理器标志................................................ ............................................ 39

3.9

处理器土地坐标............................................... ................................. 40

土地上市............................................................................................................... 43

4.1

双核英特尔®至强®处理器5000系列的土地分配............................... 43

4.1.1土地房源来源地名称.......................................... ............................ 43

4.1.2土地清单陆数.......................................... ......................... 52

信号定义...................................................................................................... 61

5.1

信号定义................................................ .............................................. 61

热指标................................................ ................................................ 69

6.1

封装热性能规格............................................... ............................ 69

6.1.1热性能规格............................................. ............................... 69

6.1.2热计量............................................. .................................... 75

6.2

处理器散热功能............................................... ................................. 77

6.2.1温度监控器............................................. ........................................ 77

6.2.2点播方式........................................... ....................................... 77

6.2.3 PROCHOT ＃信号............................................ ...................................... 78

6.2.4 FORCEPR ＃信号............................................ ....................................... 78

6.2.5 THERMTRIP ＃信号............................................ ................................... 78

双核英特尔®至强®处理器5000系列数据表

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