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EPM570F256I5N 参数 Datasheet PDF下载

EPM570F256I5N图片预览
型号: EPM570F256I5N
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash PLD, 8.7ns, 440-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256]
分类和应用:
文件页数/大小: 88 页 / 982 K
品牌: INTEL [ INTEL ]
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Chapter 1: Introduction  
1–3  
Features  
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA,  
and thin quad flat pack (TQFP) packages (refer to Table 1–3 and Table 1–4). MAX II  
devices support vertical migration within the same package (for example, you can  
migrate between the EPM570, EPM1270, and EPM2210 devices in the 256-pin  
FineLine BGA package). Vertical migration means that you can migrate to devices  
whose dedicated pins and JTAG pins are the same and power pins are subsets or  
supersets for a given package across device densities. The largest density in any  
package has the highest number of power pins; you must lay out for the largest  
planned density in a package to provide the necessary power pins for migration. For  
I/O pin migration across densities, cross reference the available I/O pins using the  
device pin-outs for all planned densities of a given package type to identify which  
®
I/O pins can be migrated. The Quartus II software can automatically cross-reference  
and place all pins for you when given a device migration list.  
Table 1–3. MAX II Packages and User I/O Pins  
68-Pin  
Micro  
100-Pin  
Micro  
144-Pin  
Micro  
256-Pin  
Micro  
100-Pin  
256-Pin  
324-Pin  
FineLine FineLine FineLine 100-Pin 144-Pin FineLine  
FineLine FineLine FineLine  
Device  
EPM240  
BGA (1)  
BGA (1)  
BGA  
TQFP  
TQFP  
BGA (1)  
BGA (1)  
BGA  
BGA  
80  
80  
80  
EPM240G  
EPM570  
76  
76  
76  
116  
116  
160  
212  
160  
212  
204  
EPM570G  
EPM1270  
EPM1270G  
EPM2210  
EPM2210G  
EPM240Z  
EPM570Z  
Note to Table 1–3:  
272  
54  
80  
76  
116  
160  
(1) Packages available in lead-free versions only.  
Table 1–4. MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes  
68-Pin  
Micro  
100-Pin  
Micro  
144-Pin  
Micro  
256-Pin  
Micro  
100-Pin  
256-Pin  
324-Pin  
FineLine FineLine FineLine 100-Pin 144-Pin FineLine FineLine FineLine FineLine  
Package  
Pitch (mm)  
Area (mm2)  
BGA  
BGA  
BGA  
TQFP  
TQFP  
BGA  
BGA  
BGA  
BGA  
0.5  
0.5  
1
0.5  
0.5  
0.5  
0.5  
1
1
25  
36  
121  
256  
484  
49  
121  
289  
361  
Length × width  
(mm × mm)  
5 × 5  
6 × 6  
11 × 11  
16 × 16 22 × 22  
7 × 7  
11 × 11  
17 × 17  
19 × 19  
© August 2009 Altera Corporation  
MAX II Device Handbook