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EPM1270GT144C5N 参数 Datasheet PDF下载

EPM1270GT144C5N图片预览
型号: EPM1270GT144C5N
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash PLD, 10ns, 980-Cell, CMOS, PQFP144, 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144]
分类和应用: 输入元件可编程逻辑
文件页数/大小: 88 页 / 982 K
品牌: INTEL [ INTEL CORPORATION ]
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Chapter 1: Introduction
Features
1–3
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA,
and thin quad flat pack (TQFP) packages (refer to
and
MAX II
devices support vertical migration within the same package (for example, you can
migrate between the EPM570, EPM1270, and EPM2210 devices in the 256-pin
FineLine BGA package). Vertical migration means that you can migrate to devices
whose dedicated pins and JTAG pins are the same and power pins are subsets or
supersets for a given package across device densities. The largest density in any
package has the highest number of power pins; you must lay out for the largest
planned density in a package to provide the necessary power pins for migration. For
I/O pin migration across densities, cross reference the available I/O pins using the
device pin-outs for all planned densities of a given package type to identify which
I/O pins can be migrated. The Quartus
®
II software can automatically cross-reference
and place all pins for you when given a device migration list.
Table 1–3.
MAX II Packages and User I/O Pins
68-Pin
Micro
FineLine
BGA
54
100-Pin
Micro
FineLine
BGA
80
76
80
76
100-Pin
FineLine
BGA
80
76
144-Pin
Micro
FineLine
BGA
116
256-Pin
Micro
FineLine
BGA
160
212
160
256-Pin
FineLine
BGA
160
212
204
324-Pin
FineLine
BGA
272
Device
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
EPM240Z
EPM570Z
100-Pin
TQFP
80
76
144-Pin
TQFP
116
116
Note to
(1) Packages available in lead-free versions only.
Table 1–4.
MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes
68-Pin
Micro
FineLine
BGA
0.5
25
5×5
100-Pin
Micro
FineLine
BGA
0.5
36
6×6
100-Pin
FineLine
BGA
1
121
11 × 11
144-Pin
Micro
FineLine
BGA
0.5
49
7×7
256-Pin
Micro
FineLine
BGA
0.5
121
11 × 11
256-Pin
FineLine
BGA
1
289
17 × 17
324-Pin
FineLine
BGA
1
361
19 × 19
Package
Pitch (mm)
Area (mm2)
Length × width
(mm × mm)
100-Pin
TQFP
0.5
256
16 × 16
144-Pin
TQFP
0.5
484
22 × 22