欢迎访问ic37.com |
会员登录 免费注册
发布采购

EPF10K20TI144-4N 参数 Datasheet PDF下载

EPF10K20TI144-4N图片预览
型号: EPF10K20TI144-4N
PDF下载: 下载PDF文件 查看货源
内容描述: [Loadable PLD, 0.6ns, CMOS, PQFP144, TQFP-144]
分类和应用:
文件页数/大小: 143 页 / 1990 K
品牌: INTEL [ INTEL ]
 浏览型号EPF10K20TI144-4N的Datasheet PDF文件第4页浏览型号EPF10K20TI144-4N的Datasheet PDF文件第5页浏览型号EPF10K20TI144-4N的Datasheet PDF文件第6页浏览型号EPF10K20TI144-4N的Datasheet PDF文件第7页浏览型号EPF10K20TI144-4N的Datasheet PDF文件第9页浏览型号EPF10K20TI144-4N的Datasheet PDF文件第10页浏览型号EPF10K20TI144-4N的Datasheet PDF文件第11页浏览型号EPF10K20TI144-4N的Datasheet PDF文件第12页  
FLEX 10K Embedded Programmable Logic Device Family Data Sheet  
The logic array consists of logic array blocks (LABs). Each LAB contains  
eight LEs and a local interconnect. An LE consists of a 4-input look-up  
table (LUT), a programmable flipflop, and dedicated signal paths for carry  
and cascade functions. The eight LEs can be used to create medium-sized  
blocks of logic—8-bit counters, address decoders, or state machines—or  
combined across LABs to create larger logic blocks. Each LAB represents  
about 96 usable gates of logic.  
Signal interconnections within FLEX 10K devices and to and from device  
pins are provided by the FastTrack Interconnect, a series of fast,  
continuous row and column channels that run the entire length and width  
of the device.  
Each I/ O pin is fed by an I/ O element (IOE) located at the end of each row  
and column of the FastTrack Interconnect. Each IOE contains a  
bidirectional I/ O buffer and a flipflop that can be used as either an output  
or input register to feed input, output, or bidirectional signals. When used  
with a dedicated clock pin, these registers provide exceptional  
performance. As inputs, they provide setup times as low as 1.6 ns and  
hold times of 0 ns; as outputs, these registers provide clock-to-output  
times as low as 5.3 ns. IOEs provide a variety of features, such as JTAG  
BST support, slew-rate control, tri-state buffers, and open-drain outputs.  
Figure 1 shows a block diagram of the FLEX 10K architecture. Each group  
of LEs is combined into an LAB; LABs are arranged into rows and  
columns. Each row also contains a single EAB. The LABs and EABs are  
interconnected by the FastTrack Interconnect. IOEs are located at the end  
of each row and column of the FastTrack Interconnect.  
8
Altera Corporation