Networking Silicon — 82551IT
12.0
Package and Pinout Information
12.1
Package Information
The 82551IT is a 196-pin Ball Grid Array (BGA) package. Package dimensions are shown in
Figure 28. More information on Intel® device packaging is available in the Intel Packaging
Handbook.
Figure 28. Dimension Diagram for the 196-pin BGA
1.56 +/-0.19
0.85
30 o
0.40 +/-0.10
0.32 +/-0.04
Seating Plate
Note: All dimensions are in millimeters.
Substrate change from
0.36 mm to 0.32 mm
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Datasheet
89
INTEL [ INTEL ]
