Mechanical Specifications
4.4
Package Handling Guidelines
Table 4-2 includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
Table 4-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
Tensile
Torque
356 N [80 lbf]
156 N [35 lbf]
8 N-m [70 lbf-in]
1, 4, 5
2, 4, 5
3, 4, 5
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5. Handling guidelines are for the package only and do not include the limits of the processor socket.
4.5
4.6
4.7
Package Insertion Specifications
The processor can be inserted into and removed from a mPGA604 socket 15 times. The socket
should meet the mPGA604 requirements detailed in the mPGA604 Socket Design Guidelines.
Processor Mass Specifications
The typical mass of the processor is 34 g [1.20 oz]. This mass [weight] includes all the components
that are included in the package.
Processor Materials
Table 4-3 lists some of the package components and associated materials.
Table 4-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Substrate
Nickel Plated Copper
Fiber-Reinforced Resin
Gold Plated Copper
Substrate Pins
66
64-bit Intel® Xeon™ Processor MP with up to 8MB L3 Cache Datasheet
INTEL [ INTEL ]
