10 Debug Tools Specifications
10.1
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use
in debugging systems. Tektronix and Agilent should be contacted to get specific information about
their logic analyzer interfaces. The following information is general in nature. Specific information
must be obtained from the logic analyzer vendor.
Due to the complexity of multiprocessor systems, the LAI is critical in providing the ability to
probe and capture front side bus signals. There are two sets of considerations to keep in mind when
designing systems that can make use of an LAI: mechanical and electrical.
10.1.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may differ from the space normally occupied by the
processor heatsink. If this is the case, the logic analyzer vendor will provide a cooling solution as
part of the LAI.
10.1.2
Electrical Considerations
The LAI will also affect the electrical performance of the front side bus; therefore, it is critical to
obtain electrical load models from each of the logic analyzer vendors to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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64-bit Intel® Xeon™ Processor MP with up to 8MB L3 Cache Datasheet
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