®
MOBILE PENTIUM PROCESSOR WITH MMX™ TECHNOLOGY
Maximum
Ringback
V , nominal
SS
Figure 17. Maximum Ringback Associated with the Signal Low State
5.0. MECHANICAL SPECIFICATIONS
be excised and lead formed at the customer
manufacturing site. Recommendations for the
manufacture of this package are included in the
1996 Packaging Databook (Order Number 240800)
or at www.intel.lv/design/packtech/chap12.pdf.
Today's portable computers face the challenge of
meeting desktop performance in an environment
that is constrained by thermal, mechanical and
electrical
design
considerations.
These
considerations have driven the development and
implementation of Intel’s Tape Carrier Package
(TCP). The Intel TCP has been designed to offer a
high pin count, low profile, reduced footprint
package with uncompromised thermal and electrical
performance. Intel continues to provide packaging
solutions that meet our rigorous criteria for quality
and performance.
Figure 18 shows a cross-section view of the TCP
as mounted on the Printed Circuit Board. Figures
19 and 20 show the TCP as shipped in its slide
carrier, and key dimensions of the carrier and
package. Figure 21 shows a cross-section detail of
the package. Figure 22 shows an enlarged view of
the outer lead bond area of the package.
Key features of the TCP include: surface mount
technology design, lead pitch of 0.25 mm, polyimide
body size of 24 mm and polyimide up for pick-and-
place handling. TCP components are shipped with
the leads flat in slide carriers, and are designed to
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INTEL [ INTEL ]
