Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 866 MHz
List of Figures
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Second Level (L2) Cache Implementation ........................................................... 7
AGTL+ Bus Topology in a Uniprocessor Configuration ......................................12
AGTL+ Bus Topology in a Dual-Processor Configuration ...................................12
Stop Clock State Machine ...................................................................................12
Processor Vcc
CMOS
Package Routing ................................................................16
BSEL[1:0] Example for a 100/133 MHz or 100 MHz Only System Design .........21
BCLK, PICCLK, and TCK Generic Clock Waveform...........................................31
System Bus Valid Delay Timings ........................................................................31
System Bus Setup and Hold Timings..................................................................31
System Bus Reset and Configuration Timings....................................................32
Power-On Reset and Configuration Timings.......................................................32
Test Timings (TAP Connection) ..........................................................................33
Test Reset Timings .............................................................................................33
BCLK, PICCLK Generic Clock Waveform at the Processor Pins........................34
Low to High AGTL+ Receiver Ringback Tolerance.............................................35
Maximum Acceptable AGTL+ Overshoot/Undershoot Waveform .......................41
Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback 1 ..................41
Processor Functional Die Layout ........................................................................44
Package Dimensions...........................................................................................46
Top Side Processor Markings .............................................................................48
Intel
®
Pentium
®
III Processor Pinout ...................................................................49
Conceptual Boxed Intel
®
Pentium
®
III Processor for the PGA370 Socket ..........60
Side View of Space Requirements for the Boxed Processor ..............................61
Side View of Space Requirements for the Boxed Processor ..............................61
Dimensions of Mechanical Step Feature in Heatsink Base.................................62
Clip Keepout Requirements and Recommended EMI Ground Pad
Location for Boxed Intel
®
Pentium
®
III Processors .............................................62
Boxed Processor Fan Heatsink Power Cable Connector Description.................63
Motherboard Power Header Placement Relative to the Boxed
Intel
®
Pentium
®
III Processor ..............................................................................64
Thermal Airspace Requirement for all Boxed Intel
®
Pentium
®
III Processor
Fan Heatsinks in the PGA370 Socket .................................................................65
Datasheet
5
INTEL [ INTEL CORPORATION ]
