Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 866 MHz
1.1
Terminology
In this document, a ‘#’ symbol after a signal name refers to an active low signal. This means that a
signal is in the active state (based on the name of the signal) when driven to a low level. For
example, when FLUSH# is low, a flush has been requested. When NMI is high, a nonmaskable
interrupt has occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as
address
or
data),
the ‘#’ symbol implies that the signal
is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to
a hex ‘A’ (H= High logic level, L= Low logic level).
The term “system bus” refers to the interface between the processor, system core logic (a.k.a. the
chipset components), and other bus agents.
1.1.1
Package and Processor Terminology
The following terms are used often in this document and are explained here for clarification:
•
Pentium
®
III
processor
- The entire product including all internal components.
•
PGA370 socket
- 370-pin Zero Insertion Force (ZIF) socket which a FC-PGA or PPGA
packaged processor plugs into.
•
FC-PGA
- Flip Chip Pin Grid Array. The package technology used on Pentium
III
processors
for the PGA370 socket.
•
Advanced Transfer Cache (ATC)
- New L2 cache architecture unique to the 0.18 micron
Pentium
III
processors. ATC consists of microarchitectural improvements that provide a higher
data bandwidth interface into the processor core that is completely scaleable with the
processor core frequency.
•
Keep-out zone
- The area on or near a FC-PGA packaged processor that system designs can
not utilize.
•
Keep-in zone
- The area of a FC-PGA packaged processor that thermal solutions may utilize.
•
OLGA
- Organic Land Grid Array. The package technology for the core used in S.E.C.C. 2
processors that permits attachment of the heatsink directly to the die.
•
PPGA - Plastic Pin Grid Array.
The package technology used for Intel
®
Celeron
TM
processors that utilize the PGA370 socket.
•
Processor
- For this document, the term processor is the generic form of the Pentium
III
processor for the PGA370 socket in the FC-PGA package.
•
Processor core
- The processor’s execution engine.
•
S.E.C.C.
- The processor package technology called “Single Edge Contact Cartridge”. Used
with Intel
®
Pentium
®
II processors.
•
S.E.C.C. 2
- The follow-on to S.E.C.C. processor package technology. This differs from its
predecessor in that it has no extended thermal plate, thus reducing thermal resistance. Used
with Intel
®
Pentium
®
III
processors and latest versions of the Intel
®
Pentium
®
II processor.
•
SC242
- The 242-contact slot connector (previously referred to as slot 1 connector) that the
S.E.C.C. and S.E.C.C. 2 plug into, just as the Intel
®
Pentium
®
Pro processor uses socket 8.
The cache and L2 cache are an industry designated names.
8
Datasheet
INTEL [ INTEL CORPORATION ]
