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631 参数 Datasheet PDF下载

631图片预览
型号: 631
PDF下载: 下载PDF文件 查看货源
内容描述: 英特尔奔腾4处理器 [Intel Pentium 4 Processor]
分类和应用:
文件页数/大小: 106 页 / 3572 K
品牌: INTEL [ INTEL ]
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Balanced Technology Extended (BTX) Boxed Processor Specifications  
Figure 28.  
Requirements for the Balanced Technology Extended (BTX) Type II Keep-out  
Volume  
NOTE: Diagram does not show the attached hardware for the clip design and is provided only as a  
mechanical representation.  
8.1.2  
8.1.3  
Boxed Processor Thermal Module Assembly Weight  
The boxed processor thermal module assembly for Type I BTX will not weigh more than  
1200 grams. The boxed processor thermal module assembly for Type II BTX will not  
weigh more than 1200 grams. See Chapter 5 and the appropriate processor Thermal  
and Mechanical Design Guidelines (see Section 1.2) for details on the processor weight  
and thermal module assembly requirements.  
Boxed Processor Support and Retention Module (SRM)  
The boxed processor TMA requires an SRM assembly provided by the chassis  
manufacturer. The SRM provides the attach points for the TMA and provides structural  
support for the board by distributing the shock and vibration loads to the chassis base  
pan. The boxed processor TMA will ship with the heatsink attach clip assembly, duct  
and screws for attachment. The SRM must be supplied by the chassis hardware vendor.  
See the Support and Retention Module (SRM) External Design Requirements  
98  
Datasheet  
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